Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Reexamination Certificate
2001-10-30
2003-10-07
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
C156S345420, C438S464000, C438S976000
Reexamination Certificate
active
06629553
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method and a system for mounting a semiconductor device or an electronic component, which comprises dicing a semiconductor wafer into semiconductor devices (semiconductor chips) or cutting electronic components attached in a row on a unit basis, picking up the diced semiconductor devices or the cut electronic components, and then mounting them on a mounting board such as a circuit board constructing an IC card or the like; a separating system for the semiconductor device or the electronic component; and an IC card fabricating method.
2. Description of the Related Art
For example, conventional techniques JP-A-6-295930 (hereinafter referred to as a known example 1) and JP-A-6-97214 (hereinafter referred to as a known example 2) for dicing a semiconductor wafer in a state where it is bonded to an adhesive sheet into semiconductor devices (semiconductor chips) and picking up the diced semiconductor devices while peeling them from the adhesive sheet are known.
The known example 1 describes a technique such that the back face of an adhesive sheet from which semiconductor chips to be peeled are bonded is rubbed by sliding pins, thereby weakening the adhesive strength to the semiconductor chips. The semiconductor chips are uniformly lifted by raising pushing pins provided around the sliding pins together with the sliding pins, thereby peeling off the semiconductor chips having the weakened adhesive strength from the adhesive sheet.
The known example 2 describes a technique such that an adhesive sheet to which a number of pellets are adhered is fixedly held with the side of the pellets facing downward, a ball shaped lower end of a needle unit forms a face pressing the adhesive sheet and needles each having a sharp tip are protruded downward from the needle unit. Consequently, the pellets are peeled from the adhesive sheet and are adsorbed by a collet positioned below.
A conventional technique disclosed in JP-A-1-264236 (hereinafter referred to as a known example 3) for dicing a semiconductor wafer adhered to an adhesive sheet into semiconductor devices (semiconductor chips) is also known. The known example 3 describes a wafer breaking technique for cutting and separating semiconductor devices in a wafer state into separate devices by pressing a roller having an expanded central part against the back face of an adhesive sheet adhered to a frame ring by which a semi-full cut wafer is fixed and moving the roller.
A semiconductor chip to be mounted on an IC card or the like, for example, is requested to be thinner from the necessity of reducing the thickness of a product such as an IC card. Consequently, when a product such as an IC card is fabricated by mounting a thin semiconductor chip on a circuit board (mounting board) constructing a product such as an IC card, it is necessary to execute it without damaging or cracking the thin semiconductor chip.
According to the known example 1, however, since the semiconductor chip is peeled from the adhesive sheet by lifting the pushing pins provided around the sliding pins together with the sliding pins so as to uniformly lift the semiconductor chip, the separated area is small for the adhesive face of the semiconductor chip. In case of employing a thin semiconductor chip, the possibility that the thin semiconductor chip cannot be separated but is cracked or damaged is high.
According to the known example 2 as well, the pellets are peeled from the adhesive sheet by downwardly protruding the needle having the sharp tip. Consequently, in case of the thin semiconductor chip, the possibility that it cannot be separated but is cracked or damaged is high.
The known example 3 relates to the wafer breaking technique for separating the semiconductor devices in a wafer state into devices.
As mentioned above, all of the known examples have not considered with respect to a point such that a thin semiconductor wafer adhered to an adhesive sheet is diced into a group of thin semiconductor devices (semiconductor chips) and the group of thin semiconductor devices in a row is peeled from the adhesive sheet and separated from the adhesive sheet by a vacuum collet at high speed without damaging or cracking the semiconductor device.
SUMMARY OF THE INVENTION
It is an object of the invention to solve the above problems and to provide a semiconductor device mounting method and a system for fabricating high-quality products by dicing a thin semiconductor wafer in a state where it is adhered to an adhesive sheet into thin semiconductor devices (semiconductor chips), peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, and conveying the group of peeled semiconductor devices in order to mount on the mounting board.
It is another object of the invention to provide a semiconductor device separating system for dicing a thin semiconductor wafer in a state where it is adhered to an adhesive sheet into thin semiconductor devices (semiconductor chips), peeling the group of the diced thin semiconductor devices in a row from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, and separating them by a vacuum collet.
It is still another object of the present invention to provide an electronic component mounting method and system as well as a separating system for fabricating high-quality products by cutting electronic components in a row adhered to an adhesive sheet on a unit basis, peeling the group of the electronic components from the adhesive sheet at high speed without damaging or cracking the electronic components, conveying the group of peeled electronic components in serial order, and mounting them to the mounting board.
It is a further object of the present invention to provide an IC card fabricating method for fabricating high-quality thin IC cards efficiently at low cost.
According to the invention, in order to achieve the object, there is provided a semiconductor device mounting system comprising: separating means for peeling off a group of semiconductor devices for an object obtained by dicing a semiconductor wafer adhered to an adhesive sheet from the adhesive sheet; conveying means for conveying the group of semiconductor devices peeled from the adhesive sheet by the separating means in serial order to a mounting position; and mounting means for relatively positioning an electrode formed in the semiconductor device conveyed by the conveying means and an electrode formed on the mounting board and mounting the semiconductor device onto the mounting board.
According to the invention, there is provided a semiconductor device mounting system comprising: separating means for peeling a group of semiconductor devices in a row for an object obtained by dicing a semiconductor wafer adhered to an adhesive sheet from the adhesive sheet in such a manner that a member having a tip in a projecting shape (including a ball shape) or a curved shape is pushed up against the back face of the adhesive sheet to thereby apply tension to the adhesive sheet and the member is moved from one end of the adhesive sheet to the other end; conveying means for conveying the group of semiconductor devices peeled from the adhesive sheet by the separating means in serial order to a desired mounting position one by one; and mounting means for relatively positioning an electrode formed in the semiconductor device conveyed by the conveying means and an electrode formed on the mounting board and mounting the semiconductor device onto the mounting board.
According to the invention, the separating means in the semiconductor device mounting system is characterized in that a pressing force of the member applied to the back face of the adhesive sheet or a press displacement is controlled. According to the invention, the separating means in the semiconductor device mounting system is characterized in that a pressing force of the member to the back face of the adhesive sheet or a press displacemen
Futagi Kazuyuki
Matsuoka Makoto
Nakagawa Toshimitsu
Odashima Hitoshi
Antonelli Terry Stout & Kraus LLP
Hitachi , Ltd.
Osele Mark A.
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