Stone working – Sawing – Reciprocating
Reexamination Certificate
2007-10-30
2011-11-15
Nguyen, George (Department: 3723)
Stone working
Sawing
Reciprocating
C125S021000, C451S488000, C451S446000, C210S663000, C210S651000
Reexamination Certificate
active
08056551
ABSTRACT:
The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 IJS/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.
REFERENCES:
patent: 2994314 (1961-08-01), Wayland et al.
patent: 4751006 (1988-06-01), Becker
patent: 5772900 (1998-06-01), Yorita et al.
patent: 5830369 (1998-11-01), Toyama
patent: 6001265 (1999-12-01), Toyama et al.
patent: 6006738 (1999-12-01), Itoh et al.
patent: 6041766 (2000-03-01), Vojtechovsky
patent: 6070570 (2000-06-01), Ueoka et al.
patent: 6085911 (2000-07-01), Greenleigh et al.
patent: 6123606 (2000-09-01), Hill et al.
patent: 6161533 (2000-12-01), Katsumata et al.
patent: 6311684 (2001-11-01), Hodsden et al.
patent: 6379224 (2002-04-01), Ito
patent: 6390896 (2002-05-01), Huber et al.
patent: 6615817 (2003-09-01), Horio
patent: 6656359 (2003-12-01), Osuda et al.
patent: 6881131 (2005-04-01), Parsells et al.
patent: 6908554 (2005-06-01), Jackson
patent: 6945242 (2005-09-01), Kondo et al.
patent: 7025054 (2006-04-01), Kondo et al.
patent: 7223344 (2007-05-01), Zavattari et al.
patent: 7381323 (2008-06-01), Umezawa et al.
patent: 2005/0155595 (2005-07-01), Kondo et al.
patent: 2007/0034573 (2007-02-01), Jangbarwala
patent: 198 41 492 (2000-03-01), None
patent: 0 791 385 (1997-08-01), None
patent: WO 02/096611 (2002-12-01), None
Meyer Burger, Slicing systems for more performance, Wire Saw DS 265, pp. 1-8, Aug. 2006.
Pall Corporation, Optimizing of Sawing and Grinding Operations by Process Water Reclamation, pp. 1-24, presented at Silicon 2006.
Berndt Rolf
Dalitz Lothar
Leydig , Voit & Mayer, Ltd.
Nguyen George
Pall Corporation
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