Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1998-10-15
2000-07-11
Picardat, Kevin M.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
438 22, 438 28, H01L 2100
Patent
active
060871954
ABSTRACT:
A method and system for fabricating lamp tiles which include a molded body and a plurality of electrically conductive leads protruding therefrom. The lamp tiles are made by overlaying an anode lead frame having anode leads, on a cathode lead frame having cathode leads, and then depositing molding material on intersected anode and cathode leads. The lamp tiles are manufactured in an assembly line process which includes a feeder to feed the anode and cathode lead frames and a molder to deposit the molding material.
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Collins D. Mark
Handy & Harman
Picardat Kevin M.
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