Method and system for manufacturing a package

Package making – Methods – Forming a cover adjunct or application of a cover adjunct to...

Reexamination Certificate

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Details

C053S450000, C053S455000, C053S133800, C053S553000, C053S562000

Reexamination Certificate

active

11204704

ABSTRACT:
A method and system for manufacturing a package include: a package-joining belt forming step for forming a package-joining belt (PC) in which packages (P) each containing a material filled in between superposed films and each sealed by joint portions (PA) and a side edge portion (PF) are joined with each other by the joint portions (PA), the package-joining belt forming step including: a superposing process of forming superposed films; a joint portion forming process of forming band-shaped joint portions (PA); a side edge portion forming process of forming band-shaped side edge portion (PF); and a filling process of filling the material; and a scar forming step for forming plural elongate scars (100) each extending adjacent and substantially perpendicularly to the side edge in the side edge portion (PF), wherein the package-joining belt forming step and the scar forming step are carried out, while the package-joining belt is drawn.

REFERENCES:
patent: 2180966 (1939-11-01), Salfisberg
patent: 2539755 (1951-01-01), Rogers et al.
patent: 3212381 (1965-10-01), Heyer
patent: 3642126 (1972-02-01), Kurtz et al.
patent: 3929047 (1975-12-01), Brandl
patent: 4147583 (1979-04-01), Deutschlander
patent: 4254601 (1981-03-01), Prager et al.
patent: 4586312 (1986-05-01), Limousin
patent: 4919272 (1990-04-01), Kai et al.
patent: 4999968 (1991-03-01), Davis
patent: 5067306 (1991-11-01), Umezawa
patent: 6343876 (2002-02-01), Takahashi et al.
patent: 03-014406 (1991-01-01), None
patent: 03-032598 (1991-02-01), None
patent: 06-008966 (1994-01-01), None

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