Method and system for locating chip-level defects through...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Using radiant energy

Reexamination Certificate

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C324S754120, C324S763010, C382S145000, C382S312000, C250S311000

Reexamination Certificate

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06995564

ABSTRACT:
Aspects for locating chip-level defects through emission imaging of a semiconductor device are described. The aspects include providing a semiconductor device for inspection within an emission imaging system. Emission detection from a frontside and backside of the semiconductor device substantially simultaneously is then performed in the emission imaging system, wherein the emissions detected indicate potential defects within the semiconductor device.

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