METHOD AND SYSTEM FOR LOCALLY SEALING A VACUUM MICROCAVITY,...

Measuring and testing – Testing sealed receptacle

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07004015

ABSTRACT:
A method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure in the microcavity and method and system for trimming resonant frequency of a microstructure in the microcavity are provided. The microcavity has an initial base pressure therein after the microcavity is locally sealed at an access passageway. The monitoring and control methods include measuring pressure in the microcavity and providing a signal when the pressure exceeds a maximum desired level. The control method also includes reducing the pressure in the microcavity to a pressure at or below the maximum desired level in response to the signal to compensate for vacuum degradation within the vacuum microcavity.

REFERENCES:
patent: 5976994 (1999-11-01), Nguyen et al.
patent: 6169321 (2001-01-01), Nguyen et al.
patent: 6232150 (2001-05-01), Lin et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6436853 (2002-08-01), Lin et al.
patent: 6534850 (2003-03-01), Liebeskind
Enikov, Eniko T., et al., Electroplated Electro-Fluidic Interconnects For Chemical Sensors, Sensors and Actuators 84, 2000, pp. 161-164.
Cheng, Y.T., et al., Fabrication And Hermeticity Testing of A Glass-Silicon Package Formed Using Localized Aluminum/Silicon-To-Glass Bonding, IEEE, 2000, pp. 757-762.
Wang, Yuelin, et al., The Structures For Electrostatic Servo Capacitive Vacuum Sensors, Sensors and Actuators A 66, 1998, 213-217.
Lin, Liwei, MEMS Post-Packaging by Localized Heating and Bonding, IEEE, 2000, pp. 608-616.
Cheng, Yu-Ting, Localized Heating and Bonding Technique For MEMS Packaging, University of Michigan, 2000, pp. 1-109.
Cheng, Y.T., et al., Localized Bonding with PSG or Indium Solder as Intermediate Layer, IEEE, 1999, pp. 285-289.
Guckel, H., et al., Planar Processed Polysilicon Sealed Cavities For Pressure Transducer Arrays, IEDM, 1984, pp, 223-225.
Henmi, H., et al., Vacuum Packaging For Microsensors By Glass-Silicon Anodic Bonding.
Lin, Liwei, et al., Vacuum-Encapsulated Lateral Microresonators, 7thInternational Conference on Solid-State Sensors and Actuators, Berkley, California, pp. 270-273.
Chang-Chien, Patty P.L., et al., Wafer-Level Packaging Using Localized Mass Deposition, Eurosensors XV, The 11thInternational Conference on Solid-State Sensors And Actuators, Munich, Germany, Jun. 10-14, 2001, pp. 182-185.
Enikov, Eniko T., et al., Electroplated Electro-Fluidic Interconnects For Chemical Sensors, Sensors and Actuators 84, Elsevier Science, vol. 84, No. 1-2, Aug. 1, 2000, pp. 161-164.
Cheng, Y.T., et al., Localized Bonding With PSG Or Indium Solder As Intermediate Layer, Proceedings of IEEE International Conference on Micro Electro Mechanical Systems, Orlando, 1999, pp. 285-289.
Cheng, Y.T., et al., Fabrication And Hermeticity Testing Of A Glass-Silicon Package Formed Using Localized Aluminum/Silicon-To-Glass Bonding, International MEMS Conference, 2000, pp. 757-762.
Lin, Liwei, MEMS Post-Packaging By Localized Heating And Bonding, IEEE Transactions On Advanced Packaging, vol. 23, No. 4, Nov. 2000, pp. 608-616.
Wang, Yuelin, et al., The Structures For Electrostatic Servo Capacitive Vacuum Sensors, Sensors And Actuators, A66, 1998, pp. 213-217.
Guckel, H., et al., Planar Processed Polysilicon Sealed Cavities For Pressure Transducer Arrays, IEEE International Electron Devices Meeting, Technical Digest, IEDM '84, pp. 223-225, San Francisco, 1984.
Yu-Ting, Cheng, Localized Heating And Bonding Technique For MEMS Packaging, Ph.D Dissertation, University of Michigan, 2000.
Henmi, H., et al., Vacuum Packaging For Microsensors By Glass-Silicon Anodic Bonding, International Conference ON Solid State Sensors And Actuators, Transducers 93, pp. 584-587, 1993.
Lin, Liwei, et al., Vacuum-Encapsulated Lateral Microresonators, Digest of Technical Papers, 7thInternational Conference on Solid State Sensors and Actuators, pp. 270-273, Yokohama, Jun. 1993.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

METHOD AND SYSTEM FOR LOCALLY SEALING A VACUUM MICROCAVITY,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with METHOD AND SYSTEM FOR LOCALLY SEALING A VACUUM MICROCAVITY,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and METHOD AND SYSTEM FOR LOCALLY SEALING A VACUUM MICROCAVITY,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3690514

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.