Method and system for introducing flux onto at least one surface

Details Method and system for introducing flux onto at least one surface Method and system for introducing flux onto at least one surface

1998-03-27

2000-02-01

Ryan, Patrick

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228 36, 228223, B23K 3102, B23K 120

Patent

active

060192755

ABSTRACT:
A method and system for introducing flux onto at least one surface of a solder pump achieve their objects as follows. A solder pump nozzle is submerged into a flux reservoir. In response to such submersion, the flux in the reservoir is actively introduced into the solder pump nozzle. In one embodiment, the active introduction is achieved by creating a negative pressure in a solder pump nozzle such that flux fills a vacated volume. The created negative pressure is produced by moving a solder column, contained within the solder pump nozzle, under the influence of an applied electric current and an applied magnetic field.

REFERENCES:
patent: 1702234 (1929-02-01), Goodridge
patent: 5377961 (1995-01-01), Smith et al.

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