Method and system for in-situ monitoring of mixing ratio of...

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S008000, C451S053000, C156S345130, C156S345150

Reexamination Certificate

active

06884149

ABSTRACT:
A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.

REFERENCES:
patent: 5191388 (1993-03-01), Kilham
patent: 5619043 (1997-04-01), Preikschat et al.
patent: 5962343 (1999-10-01), Kasai et al.
patent: 6296548 (2001-10-01), Wiswesser et al.
patent: 6572964 (2003-06-01), Tanaka et al.

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