Method and system for improved lithographic processing

Details Method and system for improved lithographic processing Method and system for improved lithographic processing

2005-09-12

2010-11-02

Huff, Mark F (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C430S005000, C430S311000, C438S014000

Reexamination Certificate

active

07824827

ABSTRACT:
A method is described for setting up the lithographic processing of a substrate. The lithographic processing typically is characterized by a set of selectable process parameters, such as the thickness, real refractive index, and absorption coefficient of a bottom anti-reflective layer. The method includes selecting a set of values for the selectable process parameters, determining the substrate reflectivity in the resist layer for these parameters, and evaluating if the determined substrate reflectivity is smaller than a maximum allowable substrate reflectivity in the resist layer. The maximum allowable substrate reflectivity is determined according to a floating criterion, i.e., the maximum allowable substrate reflectivity depends on a Normalized Image Log Slope related parameter.

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Mack, Chris, “The Lithography Expert: Designing a Bottom Antireflective Coating”, Microlithography World, dated Feb. 2005.

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