Method and system for identifying and locating defects in an...

Details Method and system for identifying and locating defects in an... Method and system for identifying and locating defects in an...

2006-05-09

2006-05-09

Raymond, Edward (Department: 2857)

Data processing: measuring, calibrating, or testing

Testing system

Of circuit

C438S106000

Reexamination Certificate

active

07043389

ABSTRACT:
A method and system for detecting and locating defects in an integrated circuit. A time-varying input signal is applied to the integrated circuit, power signals produced at a plurality of respective ordered connections in response to the input signal are measured, and one or more defects in the integrated circuit are identified from the power signals so measured. A system is provided having a probe for connecting to the die of an integrated circuit prior to final packaging, a testing system for applying transient input signals to the die and acquiring die power signal measurements in response thereto, and a data processor for determining whether the power signal measurements indicate the presence of a defect in the die. Also provided is a method for reducing the effect of contact resistance from test probe connections. As a way of implementing the approach of the method and system there is also provided an integrated circuit having a plurality of ordered connections to the power grid and a plurality of calibration circuits associated with respective ordered connections so as to selectively inject transient signals onto the power grid at respective locations.

REFERENCES:
patent: 6496028 (2002-12-01), Manhaeve et al.
patent: 6833724 (2004-12-01), Binkley et al.

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