Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2006-05-02
2010-02-23
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S460000, C219S121690, C257SE21599
Reexamination Certificate
active
07666759
ABSTRACT:
A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
REFERENCES:
patent: 5374590 (1994-12-01), Batdorf et al.
patent: 5656186 (1997-08-01), Mourou et al.
patent: 5744780 (1998-04-01), Chang et al.
patent: 6340806 (2002-01-01), Smart et al.
patent: 6341029 (2002-01-01), Fillion et al.
patent: 6495791 (2002-12-01), Hunter et al.
patent: 6501061 (2002-12-01), Kitai et al.
patent: 6573473 (2003-06-01), Hunter et al.
patent: 6639177 (2003-10-01), Ehrmann et al.
patent: 6662063 (2003-12-01), Hunter et al.
patent: 6777645 (2004-08-01), Ehrmann et al.
patent: 6838639 (2005-01-01), Kreuter et al.
patent: 6951995 (2005-10-01), Couch et al.
patent: 6989508 (2006-01-01), Ehrmann et al.
patent: 7015418 (2006-03-01), Cahill et al.
patent: 7027155 (2006-04-01), Cordingley et al.
patent: 7050208 (2006-05-01), Overbeck
patent: 7119351 (2006-10-01), Woelki
patent: 7148447 (2006-12-01), Ehrmann et al.
patent: 7176407 (2007-02-01), Hunter et al.
patent: 7192846 (2007-03-01), Cordingley et al.
patent: 2002/0167581 (2002-11-01), Cordingley et al.
patent: 2003/0178396 (2003-09-01), Naumov et al.
patent: 2004/0134896 (2004-07-01), Gu et al.
patent: 2004/0144760 (2004-07-01), Cahill et al.
patent: 2004/0188399 (2004-09-01), Smart
patent: 2005/0199598 (2005-09-01), Hunter et al.
patent: 2005/0233537 (2005-10-01), Couch et al.
patent: 2006/0000814 (2006-01-01), Gu et al.
patent: 2006/0028655 (2006-02-01), Cordingley et al.
patent: 2006/0086702 (2006-04-01), Smart
patent: 2006/0108337 (2006-05-01), Gu et al.
patent: 2006/0151704 (2006-07-01), Cordingley
patent: 2006/0186096 (2006-08-01), Schramm
patent: 2006/0189091 (2006-08-01), Gu
patent: 2006/0191884 (2006-08-01), Johnson et al.
patent: 2006/0192845 (2006-08-01), Cordingley et al.
patent: 2006/0199354 (2006-09-01), Gu
patent: 2006/0207975 (2006-09-01), Ehrmann et al.
patent: 2006/0216927 (2006-09-01), Cordingley et al.
patent: 2006/0256181 (2006-11-01), Ehrmann et al.
patent: 2007/0031993 (2007-02-01), Nemets et al.
patent: 2007/0052791 (2007-03-01), Cordingley et al.
patent: 2007/0075058 (2007-04-01), Ehrmann et al.
patent: 2007/0106416 (2007-05-01), Griffiths et al.
patent: 2007/0117227 (2007-05-01), Gu
patent: 2007/0173075 (2007-07-01), Lee et al.
patent: 2007/0178714 (2007-08-01), Gu et al.
patent: 2007/0199927 (2007-08-01), Gu et al.
patent: 2007/0215575 (2007-09-01), Gu et al.
patent: 2007/0215820 (2007-09-01), Cordingley et al.
patent: 2008/0011852 (2008-01-01), Gu et al.
patent: 2008/0035614 (2008-02-01), Smart
patent: 2008/0067155 (2008-03-01), Gu
patent: 2008/0073438 (2008-03-01), Gu et al.
patent: 2008/0094640 (2008-04-01), Cordingley et al.
patent: H2-137682 (1980-05-01), None
patent: 05-1927779 (1993-03-01), None
patent: 07-124764 (1995-05-01), None
patent: 2531453 (1996-06-01), None
patent: 2001-170788 (2001-06-01), None
patent: 2001-269790 (2001-10-01), None
patent: 2003-053575 (2003-02-01), None
patent: 2003-053576 (2003-02-01), None
European Search Report dated Feb. 6, 2008 for European Serial No. 03 71 4419.3.
Smart, Donald, et al., Link Processing With Lasers (Jul. 1998, Semicon West, pp. 1-20).
Couch Bruce L.
Ehrmann Jonathan S.
Johnson Shepard D.
Lento Joseph V.
Brooks & Kushman P.C.
Ghyka Alexander G
GSI Lumonics Corporation
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