Method and system for forming a semiconductor device

Details Method and system for forming a semiconductor device Method and system for forming a semiconductor device

2005-03-01

2005-03-01

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C430S312000

Reexamination Certificate

active

06861365

ABSTRACT:
A method and system for forming a semiconductor device is provided. The method and system involves the utilization of a stamping tool to generate three-dimensional resist structures whereby thin film patterning steps can be transferred to the resist in a single molding step and subsequently revealed in later processing steps. Accordingly, the alignments between successive patterning steps can be determined by the accuracy with which the stamping tool has been fabricated, regardless of the dilations or contractions that can take place during the fabrication process.

REFERENCES:
patent: 5308415 (1994-05-01), Chou
patent: 6165911 (2000-12-01), Calveley
patent: 6255035 (2001-07-01), Minter et al.
patent: 6519761 (2003-02-01), Satoh
patent: 2002162747 (2000-11-01), None

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