Wave transmission lines and networks – Coupling networks – Balanced to unbalanced circuits
Reexamination Certificate
2011-05-17
2011-05-17
Takaoka, Dean O (Department: 2817)
Wave transmission lines and networks
Coupling networks
Balanced to unbalanced circuits
C333S101000
Reexamination Certificate
active
07944322
ABSTRACT:
Methods and systems for a flip chip configurable RF front end with an off-chip balun may include bonding a balun package to a single integrated circuit (IC) comprising an integrated transmitter and a receiver. The balun package may comprise one or more layers and may be electrically coupled to the IC. The balun package may comprise various devices such as, for example, inductors, capacitors, resistors, and/or switches, which may be on an exterior surface and/or inner layers of the balun package. Accordingly, the balun package and/or the IC may be configured for receiving RF signals and/or transmitting RF signals. The balun package and/or the IC may also be configured for single-ended RF input, single-ended RF output, differential RF input, and/or differential RF output. An off-chip amplifier may be used to amplify signals on the single transmit line in the single-ended RF output mode of operation.
REFERENCES:
patent: 6982609 (2006-01-01), McKay et al.
patent: 7307331 (2007-12-01), Kipnis et al.
patent: 7348842 (2008-03-01), Ichitsubo et al.
patent: 7439842 (2008-10-01), Fujiki et al.
Broadcom Corporation
McAndrews Held & Malloy Ltd.
Takaoka Dean O
LandOfFree
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