Method and system for facilitating floorplanning for 3D IC

Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Physical design processing

Reexamination Certificate

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C716S111000, C716S119000, C716S123000, C716S129000, C716S130000, C716S135000, C716S138000

Reexamination Certificate

active

08006212

ABSTRACT:
One embodiment of the present invention provides a system for facilitating floorplanning for three-dimensional integrated circuits (3D ICs). During operation, the system receives a number of circuit blocks. The system places the blocks in at least one layer of a multi-layer die structure and sets an initial value of a time-varying parameter. The system then iteratively perturbs the block arrangement until the time-varying parameter reaches a pre-determined value.

REFERENCES:
patent: 7921384 (2011-04-01), Solomon
patent: 2008/0244500 (2008-10-01), Solomon
patent: 2009/0066366 (2009-03-01), Solomon
patent: 2009/0070721 (2009-03-01), Solomon
patent: 2009/0070727 (2009-03-01), Solomon
patent: 2009/0070728 (2009-03-01), Solomon
patent: 2009/0319965 (2009-12-01), Kariat et al.
Healy et al., “Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 26, No. 1, Jan. 2007, pp. 38-52.
Cheng, Lei et al., “Floorplanning for 3-D VLSI Design”, Session: Floorplanning and partitioning, pp. 405-411, Year of Publication: 2005, ISBN:0-7803-8737-6, http://portal.acm.org/citation.cfm?id=1120725.1120899&coll=portal&dl=ACM&type=series&idx=SERIES480&part=series&WantType=Proceedings&title=ASPDAC, viewed Aug. 1, 2008.
Wong, Eric et al., “3D Floorplanning with Thermal Vias”, Design, Automation and Test in Europe, 2006. Date apos; 06. Proceedings, vol. 1, Issue , Mar. 6-10, 2006 pp. 1-6.
Zhou, Pingqiang et al., “3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits”, 2007 IEEE, pp. 590-597.
Cong, Jason et al., “A Thermal-Driven Floorplanning Algorithm for 3D ICs”, http://cadlab.cs.ucla.edu/˜cong/papers/3dfp.pdf, viewed Sep. 23, 2008.
Li, Zhuoyuan et al., “Hierarchical 3-D Floorplanning Algorithm for Wirelength Optimization”, IEEE Transactions on circuits and systems—I: Regular Papers, vol. 53, No. 12, Dec. 2006, pp. 2637-2646.
Black, Bryan et al., “Die Stacking (3D) Microarchitecture”, The 39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO'06), 2006 IEEE.
“IBM adds a milestone to 3D packaging”, Posted : Jun. 1, 2007, http://www.eetindia.co.in/login.do?fromWhere=/ARTP—8800466845—1800007.HTM, viewed Sep. 23, 2008.
“The Era of Tera: Intel Reveals more about 80-core CPU”, http://www.anandtech.com/printarticle.aspx?i=2925, viewed Sep. 23, 2008, pp. 1-13.
Cong, Jason et al., “Thermal-Aware Physical Design Flow for 3-D IC's”, IEEE International VLSI Multilevel Interconnection Conference, Sep. 2006, pp. 73-80.
Law, Jill H.Y. et al., “Block Alignment in 3D Floorplan Using Layered TCG”, Proceedings of the 16th ACM Great Lakes symposium on VLSI, Apr. 2006, pp. 376-380.
Pang, Yingxin et al., “Rectilinear block packing using O-tree representation”, Proceedings of the 2001 international symposium on Physical design, Apr. 2001, pp. 156-161.
Wong, Eric et al., “3D Floorplanning with Thermal Vias”, 2006, EDAA, pp. 1-6.

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