Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2008-05-06
2008-05-06
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C257SE29167
Reexamination Certificate
active
10897271
ABSTRACT:
An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.
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Beyne Eric
De Raedt Walter
Jansen Henri
Tilmans Hendrikus
Geyer Scott B.
Interuniversitair Microelektronica Centrum (IMEC)
Knobbe Martens Olson & Bear LLP
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