Method and system for fabricating IC packages from laminated boa

Details Method and system for fabricating IC packages from laminated boa Method and system for fabricating IC packages from laminated boa

1993-08-13

1994-10-25

Vo, Peter Dungba

Metal working

Method of mechanical manufacture

Electrical device making

29417, 29DIG40, H05K 336, H05K 346

Patent

active

053576721

ABSTRACT:
A method and system for producing a plurality of integrated circuit packages having heat spreaders attached thereto. A planar metal sheet having predefined openings allows the addition of discrete bypass capacitors to the integrated circuit package. The planar metal sheet laminates to a plurality of laminated printed wiring boards. The metal sheet is then cut into sections resulting in individual packages. Each package has a cavity in which an integrated circuit die is placed therein. The integrated circuit die is in close thermal communication with the heat spreader of the package and connects to the conductive paths of the printed wiring boards. The invention is especially advantageous in manufacturing in quantity plastic pin grid array (PPGA) and plastic ball grid array (PBGA) integrated circuit packages.

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