Method and system for fabricating a multilayer laminate for a pr

Details Method and system for fabricating a multilayer laminate for a pr Method and system for fabricating a multilayer laminate for a pr

1995-01-27

1996-10-22

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 65, 156345, B44C 122

Patent

active

055673295

ABSTRACT:
In a method of fabricating a multilayer laminate for a printed wiring board, a plurality of blind via sites are etched from a first side of a first sheet, the first sheet including a flexible dielectric material, the flexible material being clad on the first and a second side with first and second layers of conductive material, respectively, through the first conductive material and the flexible material to the second conductive material. Conductive material posts are electroplated in the blind via sites, using the second layer of conductive material as an electrode. A system for fabricating a multilayer laminate for a printed wiring board and a multilayer laminate for a printed wiring board formed thereby is also disclosed.

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