Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2000-11-03
2003-03-18
Ball, Michael W. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S244110
Reexamination Certificate
active
06533884
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to the packaging industry, and more particularly to a method and system for making an embossed multi-layer flexible packaging material.
BACKGROUND OF THE INVENTION
The art of embossing entails applying pressure to a material and thereby causing the formation of a raised pattern in the material. Prior art methods usually include the use of a rigid embossing roller and a soft backing roller to achieve the final embossed product. However, there are significant drawbacks to using the prior art methods for embossing flexible packaging materials.
When a flexible packaging material is to be used for the enclosure of food products or other perishables, the barrier properties of the packaging material are of great importance. It is usually desired that the packaging material have oxygen barrier properties, moisture barrier properties, light barrier properties or a combination of these properties. Several prior art methods of embossing of a packaging material involve embossing the flexible packaging material after it is laminated. These prior art methods are unsatisfactory in that they disrupt the material having the barrier properties and thereby greatly diminish those properties.
In an effort to solve the problems associated with embossing a packaging material after it is laminated, prior art methods arose wherein a second layer of the packaging material is embossed and then laminated to a barrier layer. The disadvantage of this method, however, is that the process of laminating subsequent to embossing results in a flattening or ironing out of the embossed pattern.
Therefore, what is needed in the art is a method and a system for making embossed packaging materials that do not greatly disrupt the desired barrier properties of the packaging material and/or do not substantially flatten the embossed pattern on the flexible packaging material.
SUMMARY OF INVENTION
The present invention provides a novel method and system for extrusion embossing that remedies the deficiencies of prior art methods of embossing. In particular, the present invention provides a method and system for embossing a multi-layer flexible packaging material whereby one layer is embossed simultaneously with the extrusion of an adjacent layer and the lamination of an additional layer.
In one embodiment of the present invention, the system comprises an embossing roller and an anvil roller positioned against the embossing roller so as to form a nip between the embossing roller and the anvil roller, a means for moving the flexible packaging material through the assembly of rollers, and an extrusion die. Preferably, the system also comprises a pressure roller for pressing the embossing roller against the anvil roller.
A three-layered flexible packaging material is formed and embossed using one embodiment of the present invention in the following manner. A first layer of pre-formed material is fed in sequence to a pressure roller, an embossing roller and a nip between the embossing roller and an anvil roller. Simultaneously, a third layer of pre-formed material is fed in sequence to the anvil roller and the nip between the embossing roller and the anvil roller. Also simultaneously, a molten sheet of a second layer is extruded from an extrusion die and deposited between the first layer and the third layer at the location of the nip of the embossing roller and anvil roller.
The method and system of the present invention provide many advantages over the prior art. For example, the present invention avoids or limits the loss of barrier properties in a flexible packaging material that typically accompanies the embossing of the material. The present invention avoids or limits the loss of the embossed pattern on the flexible packaging material during production processing of the material. It is also expected that the present invention reduces the coefficient of friction of the surface of the flexible packaging material. Reducing the coefficient of friction results in the improved processing of the material on a “Form, Fill and Seal” (F/F/S) machine and possibly reduces or ameliorates the need to incorporate slip agents into the material. Finally, it is expected the present invention improves the “hand” of stiffness of the embossed flexible packaging material and thereby permits the down gauging of the material's thickness.
Other objects, features and advantages of this invention will be apparent after a review of the following detailed description of disclosed embodiments, the figures and the appended claims.
REFERENCES:
patent: 1960997 (1934-05-01), Halloran
patent: 2070600 (1937-02-01), Jenett
patent: 2815308 (1957-12-01), Robinson
patent: 3024154 (1962-03-01), Singleton et al.
patent: 3481818 (1969-12-01), Wellen
patent: 3922473 (1975-11-01), Kosaka et al.
patent: 3948709 (1976-04-01), Ida et al.
patent: 3956056 (1976-05-01), Boguslawski et al.
patent: 4085244 (1978-04-01), Stillman
patent: 4105491 (1978-08-01), Haase et al.
patent: 4370187 (1983-01-01), Katagiri et al.
patent: 4407689 (1983-10-01), Ohtsuki et al.
patent: 4556527 (1985-12-01), Sarcander
patent: 4574021 (1986-03-01), Endres et al.
patent: 4612152 (1986-09-01), Kawabata et al.
patent: 4634484 (1987-01-01), Wagner
patent: 4657614 (1987-04-01), Andersson
patent: 4826560 (1989-05-01), Held
patent: 4844766 (1989-07-01), Held
patent: 4854996 (1989-08-01), Baus
patent: 4891235 (1990-01-01), Mitzuguchi et al.
patent: 4929474 (1990-05-01), Avni et al.
patent: 4987014 (1991-01-01), Woodward et al.
patent: 4990375 (1991-02-01), Swihart
patent: 4995930 (1991-02-01), Merz et al.
patent: 5006056 (1991-04-01), Mainstone et al.
patent: 5098497 (1992-03-01), Brinley
patent: 5203941 (1993-04-01), Spain et al.
patent: 5281371 (1994-01-01), Tamura et al.
patent: 5282915 (1994-02-01), Westlake, Jr.
patent: 5312578 (1994-05-01), Aladenize et al.
patent: 5316608 (1994-05-01), Ocampo et al.
patent: 5330595 (1994-07-01), Held
patent: 5554333 (1996-09-01), Fujiki
patent: 5639331 (1997-06-01), Payne
patent: 5676791 (1997-10-01), Christel
patent: 5697027 (1997-12-01), Takagi et al.
patent: 5698054 (1997-12-01), Biagioli et al.
patent: 5723199 (1998-03-01), Boot
patent: 5738754 (1998-04-01), Hill et al.
patent: 5833792 (1998-11-01), Funaki et al.
patent: 5849129 (1998-12-01), Hogge et al.
patent: 5849137 (1998-12-01), Hogge et al.
patent: 5861074 (1999-01-01), Wu
patent: 5865926 (1999-02-01), Wu et al.
patent: 6013151 (2000-01-01), Wu et al.
patent: 6129800 (2000-10-01), Brinley
patent: 6136414 (2000-10-01), Aizawa et al.
Ball Michael W.
Corcoran Gladys
Printpack Illinois, Inc.
Sutherland & Asbill & Brennan LLP
LandOfFree
Method and system for extrusion embossing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and system for extrusion embossing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for extrusion embossing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3049245