Method and system for enhancement of wafer alignment accuracy

Details Method and system for enhancement of wafer alignment accuracy Method and system for enhancement of wafer alignment accuracy

1996-09-25

1998-03-31

Trammell, James P.

Boots, shoes, and leggings

364575, 356401, 2504911, G01B 700

Patent

active

057345945

ABSTRACT:
This computer system, as well as its method of operation, corrects the position data used to define the location of alignment marks on a workpiece. The first step is to scan marks along a first direction to determine the direction of wafer scaling along the first direction. Second, scan marks along a second direction to determine the direction of wafer scaling along the second direction. Next, scan a first set of alignment marks on a workpiece oriented in a first direction and a second set of alignment marks on the workpiece oriented in a second direction in an initial sequence to collect initial direction data on the location. Then, scan the first set of alignment marks and the second set of alignment marks in a reverse sequence to collect reverse direction data on the location. Finally, average the initial direction data and the reverse direction data. This enables correction of false alignment data attributable to falsely measured locations of alignment marks.

REFERENCES:
patent: 3901814 (1975-08-01), Davis et al.
patent: 4170418 (1979-10-01), Aiuchi et al.
patent: 4301470 (1981-11-01), Pagany
patent: 4475122 (1984-10-01), Green
patent: 4595295 (1986-06-01), Wilczynski
patent: 4723221 (1988-02-01), Matsuura et al.

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