Method and system for electrically coupling a chip to chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S081000, C257S084000, C257S678000, C257S079000, C257S080000

Reexamination Certificate

active

07015559

ABSTRACT:
A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.

REFERENCES:
patent: 4758062 (1988-07-01), Sunagawa et al.
patent: 5047835 (1991-09-01), Chang
patent: 5051790 (1991-09-01), Hammer
patent: 5198684 (1993-03-01), Sudo
patent: 5200631 (1993-04-01), Austin et al.
patent: 5237441 (1993-08-01), Nhu
patent: 5335361 (1994-08-01), Ghaem
patent: 5638469 (1997-06-01), Feldman et al.
patent: 6049639 (2000-04-01), Paniccia et al.
patent: 6215577 (2001-04-01), Koehl et al.
patent: 6229158 (2001-05-01), Minemier et al.
patent: 6477285 (2002-11-01), Shanley
patent: 6477286 (2002-11-01), Ouchi
Sclater, Neil, “Random-Access Memories (RAMs),”Electronics Technology Handbook, New York: McGraw-Hill, pp. 178-181, 1999.

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