Method and system for electrically coupling a chip to chip...

Details Method and system for electrically coupling a chip to chip... Method and system for electrically coupling a chip to chip...

2005-08-30

2005-08-30

Schillinger, Laura M. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

C257S081000, C257S083000

Reexamination Certificate

active

06936489

ABSTRACT:
A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.

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Sclater, Neil, “Random-Access Memories (RAMs),”Electronics Technology Handbook, New York: McGraw-Hill, pp. 178-181, 1999.

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