Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-01-14
2001-12-11
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S691000, C361S694000, C361S697000, C361S703000, C361S704000, C361S709000, C361S719000, C361S720000, C257S721000, C257S722000, C174S015100, C174S016100, C174S016300, C165S080300, C165S122000, C165S104330, C165S908000
Reexamination Certificate
active
06330153
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates, in general, to heat transfer mechanisms, and in particular to a method and system for removing heat generated from high power air-cooled electronic devices.
BACKGROUND OF THE INVENTION
Without limiting the scope of the invention, its background is described in connection with the removal of heat dissipated from high-powered electronic devices, associated with base station circuitry components as an example.
A base station provides a means of reception and transmission to and from wireless communication mobile units and provides an interface to a telecommunication network. For this purpose, base stations comprise a transceiver unit comprising an input for receiving signals to be transmitted, a signal processor for processing signals to be transmitted on a predetermined frequency channel, and a power amplifier for amplifying and feeding the signals to be transmitted to the transmitter unit's antenna.
High power levels generated in the transceiver's power amplifier cause increased temperature levels. If the power amplifier is not properly cooled, dramatic temperature increases could result in significant damage to the overall transceiver. Also, temperature increases generated within high performance semiconductors, such as the power transistor, could vary the electrical performance characteristics of the transceiver unit and cause the degradation of materials resulting in reduced reliability and device failure.
Typically, cooling in power amplifiers is accomplished using a large heat sink that includes cooling fins. This heat sink is directly attached to a flange of the power amplifier devices to provide low thermal resistance. Usually, at the temperature levels associated with base station power amplifiers, the passive cooling provided by the heat sink is not sufficient. Further cooling of power amplifiers may be accomplished by the use of natural airflow or by purposely applying cool airflow to the heat sinks to reduce their temperatures.
The basic idea with fan and fins is to spread heat over the surface of the heat sink enough so that it is possible to remove the heat with a relatively low airspeed fan. Use of the heat sink with fins and a fan has many shortcomings. In order to effectively remove heat generated from high-powered electronic devices at the temperature levels associated with base station power amplifiers, the heat sink would require a large surface area, resulting in an inefficient use of space. A base station comprises several power amplifiers and would require a separate fan for each amplifier. The result is an overall increase in expense for each base station and a decrease in system reliability. In the event that a fan used to cool such equipment fails, overheating could result in the destruction of base station equipment.
As may be seen, therefore, improved methods of removing generated heat from high-powered electronic devices, for example, those used in a base station environment could provide a commercially useful article and reduce replacement expenses, maintenance costs and inconvenience in sudden breakdown of base station system components.
OBJECTS OF THE INVENTION
It is an object of the present invention to provide a system for cooling an electronic device comprising a pump for generating airflow through a heat sink coupled to an electronic device.
It is an object of the present invention to provide a system for cooling an electronic device comprising a compressor for generating airflow through a heat sink coupled to an electronic device.
It is another object of the present invention to increase the velocity of airflow through a portion of the heat sink where heat dissipation is concentrated.
It is another object of the present invention to provide a heat sink coupled to an electronic device with heat sink having a channel having an inlet and an outlet with a throttle for increasing airflow velocity disposed between inlet and outlet.
It is another object of the present invention to provide an airflow control valve operably connected to the inlet of the heat sink for controlling the amount of airflow through the heat sink.
It is another object of the present invention to provide a device controller connected to the airflow control valve and to the air generation system for controlling the airflow control valve and the operation of the air generation system.
SUMMARY OF THE INVENTION
The present invention presents an improved method of removing generated heat from heat-generating electronic devices where multiple heat-generating electronic devices are used in confined spaces. For example, within a base station where multiple transceivers employing the use of power amplifiers are used, this method allows more efficient utilization of space in the base station and increases a base station's reliability and performance.
In an embodiment, the invention comprises a system for cooling an electronic device comprising an air generation system used for generating airflow through a heat sink coupled to an electronic device. The system for cooling an electronic device comprises a pump for generating airflow through the heat sink. Alternatively, the system for cooling an electronic device may comprise a compressor for generating airflow through the heat sink.
The embodiment comprises a heat sink having a channel having an inlet and an outlet with the outlet connected to the pump or the inlet connected to the compressor. The present invention efficiently removes heat from an electronic device by decreasing the cross-sectional area of the channel where the channel traverses the electronic device. The decrease in cross-sectional area increases the velocity of airflow through a portion of the heat sink where heat dissipation is concentrated.
The embodiment may also include an airflow control valve operably connected to the inlet of the heat sink for controlling the amount of airflow through the heat sink. The present invention provides a device controller connected to the airflow control valve and to the air generation system for controlling the airflow control valve and the operation of the air generation system.
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Ketonen Veli-Pekka
Laureanti Steven J.
Chervinsky Boris H.
Hayes Brooke
Nokia Telecommunications Oy
Rivers Brian T.
Tolin Gerald
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