Method and system for dissipating thermal energy from...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S700000, C361S701000, C165S080400, C165S080500, C165S104210, C165S104330, C062S259200

Reexamination Certificate

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07460367

ABSTRACT:
Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.

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