Method and system for detection of thin metal layers in packaged

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – Frequency of cyclic current or voltage

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209571, G01R 2704

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active

041669738

ABSTRACT:
Metal layers of extreme thinness, of the order of fifty Angstroms and greater are detected by use of microwave energy so propagated as to permit determination of the presence or absence of the metal in a detection zone of limited extent outwardly of the issuance location of such propagated energy. Apparatus is provided for propagating microwave energy having a characteristic which changes with propagation distance from a maximum value at the energy issuance location to a minimum value first exhibited at the outward end of the detection zone.

REFERENCES:
patent: 2609422 (1952-09-01), Hulstede
patent: 3263166 (1966-07-01), Augustine et al.
patent: 3401333 (1968-09-01), Thompson
patent: 3451546 (1969-06-01), Murley, Jr.
patent: 3473111 (1969-10-01), Leersnijder et al.
patent: 3710243 (1973-01-01), Keenan
patent: 3942107 (1976-03-01), Gerhard
patent: 4045727 (1977-08-01), Yu et al.
Summerhill, Microwaves as an Industrial Tool, Measurement & Instrument Review, Feb. 1969, pp. 79-81.
Pa Proximity Logic Modules, Metal Detectors-Proximity Controls, pp. 40 & 41.
Poole, Jr., Electron Spin Resonance, Interscience Publishers, 1967, pp. 237-240.

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