Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – For fault location
Reexamination Certificate
2011-07-26
2011-07-26
Dole, Timothy J (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
For fault location
C324S663000, C324S686000, C324S719000, C700S121000, C438S005000, C438S013000, C438S017000, C702S084000
Reexamination Certificate
active
07986146
ABSTRACT:
One exemplary embodiment is a method for detecting existence of an undesirable particle between a planar lithographic object, such as a semiconductor wafer or a lithographic mask, and a chuck during semiconductor fabrication. The exemplary method in this embodiment includes placing the planar lithographic object, such as the semiconductor wafer, over the chuck. The method further includes measuring a change in at least one electrical characteristic formed by and between the chuck and the planar lithographic object, such as measuring a change in capacitance between the chuck and semiconductor wafer, caused by the undesirable particle.
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Levinson Harry J.
Wood, II Obert Reeves
Baldridge Benjamin M
Dole Timothy J
Farjami & Farjami LLP
Globalfoundries Inc.
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