Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-09-14
2008-12-09
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C257SE21520, C257S001000
Reexamination Certificate
active
07462497
ABSTRACT:
A method and system for multi-point (e.g., double-point) GOI test that can efficiently judge failure modes by testing only two points. We can measure leakage currents at only two voltages, which are the cut points of mode A-B and B-C, instead of the whole ramped voltages to save time and cost with the same test effectiveness according to a specific embodiment. By correlating leakage current at extrinsic field to the breakdown voltage, we can also evaluate the intrinsic reliability even if the samples are not subjected to actual breakdown according to a specific embodiment.
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Chien W.T. Kary
Gong Excimer
Tseng Summer
Zhao Atman
Geyer Scott B.
Semiconductor Manufacturing International (Shanghai) Corporation
Stevenson André
Townsend and Townsend / and Crew LLP
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