Method and system for deflashing mold compound

Details Method and system for deflashing mold compound Method and system for deflashing mold compound

2005-11-01

2005-11-01

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S080000

Reexamination Certificate

active

06960119

ABSTRACT:
A method and system for deflashing mold compound is provided. In one embodiment, a method for dislodging contaminants from an integrated circuit includes directing sublimating particles against a surface of the integrated circuit. Contaminants disposed on the surface of the integrated circuit are abraded with the sublimating particles to dislodge at least a portion of the contaminants.

REFERENCES:
patent: 5766368 (1998-06-01), Bowers
patent: 5865901 (1999-02-01), Yin et al.
patent: 5928434 (1999-07-01), Goenka
patent: 6004400 (1999-12-01), Bishop et al.
patent: 6066032 (2000-05-01), Borden et al.

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