Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Reexamination Certificate
2009-02-06
2010-12-28
Garber, Charles (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
C438S029000, C438S099000, C438S164000, C438S328000, C438S623000, C257SE21046, C257SE21053, C257SE21061, C257SE21062
Reexamination Certificate
active
07858507
ABSTRACT:
A method of fabricating a photoactive array having an integrated backplane is provided. The layers of the device may be stamped or deposited on a planar or a curved substrate, such as a semispherical or ellipsoidal substrate. Each metal layer may be stamped using an elastomeric stamp and a vacuum mold. By depositing the patterned and full-surface layers in a single process, a photosensitive array with an integrated transistor backplane may be fabricated, resulting in improved sensitivity and performance.
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Ahmadi Mohsen
Garber Charles
The Regents of the University of Michigan
Townsend and Townsend / and Crew LLP
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