Method and system for cooling electronic components

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C361S688000

Reexamination Certificate

active

09995362

ABSTRACT:
A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower moves air across the heat sink.

REFERENCES:
patent: 2012527 (1935-08-01), Batchelder
patent: 2675228 (1954-04-01), Baird et al.
patent: 3571677 (1971-03-01), Oeschger
patent: 4138692 (1979-02-01), Meeker
patent: 4495545 (1985-01-01), Dufresne et al.
patent: 4558395 (1985-12-01), Yamada
patent: 4665466 (1987-05-01), Green
patent: 4721996 (1988-01-01), Tustaniwskyj
patent: 4729424 (1988-03-01), Mizuno et al.
patent: 4733331 (1988-03-01), Chauvet
patent: 4791983 (1988-12-01), Nicol
patent: 4809134 (1989-02-01), Tustaniwskyj
patent: 4870477 (1989-09-01), Nakanishi
patent: 4882654 (1989-11-01), Nelson
patent: 4977444 (1990-12-01), Nakajima
patent: 5115225 (1992-05-01), Dao et al.
patent: 5144531 (1992-09-01), Go
patent: 5166863 (1992-11-01), Shmunis
patent: 5177667 (1993-01-01), Graham
patent: 5183104 (1993-02-01), Novotny
patent: 5323847 (1994-06-01), Koizumi
patent: 5406807 (1995-04-01), Ashiwake et al.
patent: 5465192 (1995-11-01), Yoshikawa
patent: 5535094 (1996-07-01), Nelson et al.
patent: 5559674 (1996-09-01), Katsui
patent: 5675473 (1997-10-01), McDunn
patent: 5689404 (1997-11-01), Katsui
patent: 5701045 (1997-12-01), Yokozawa et al.
patent: 5706668 (1998-01-01), Hilpert
patent: 5714938 (1998-02-01), Schwabl
patent: 5816319 (1998-10-01), Kamekawa et al.
patent: 5838066 (1998-11-01), Kitajo
patent: 5912802 (1999-06-01), Nelson
patent: 5940269 (1999-08-01), Ko et al.
patent: 5978219 (1999-11-01), Lin
patent: 6024164 (2000-02-01), Sorbel
patent: 6029742 (2000-02-01), Burward-Hoy
patent: 6042348 (2000-03-01), Aakalu et al.
patent: 6050327 (2000-04-01), Gates
patent: 6109340 (2000-08-01), Nakase et al.
patent: 6115251 (2000-09-01), Patel et al.
patent: 6125924 (2000-10-01), Lin
patent: 6130820 (2000-10-01), Konstad et al.
patent: 6135200 (2000-10-01), Okochi et al.
patent: 6137680 (2000-10-01), Kodaira et al.
patent: 6170561 (2001-01-01), O'Grady
patent: 6170563 (2001-01-01), Hsieh
patent: 6205796 (2001-03-01), Chu et al.
patent: 6205803 (2001-03-01), Scaringe
patent: 6213194 (2001-04-01), Chrysler et al.
patent: 6313990 (2001-11-01), Cheon
patent: 6317321 (2001-11-01), Fitch
patent: 6333852 (2001-12-01), Lin
patent: 6364761 (2002-04-01), Steinbrecher
patent: 6396697 (2002-05-01), Chen
patent: 6397618 (2002-06-01), Chu
patent: 6421240 (2002-07-01), Patel
patent: 6438984 (2002-08-01), Novotny et al.
patent: 6526768 (2003-03-01), Wall
patent: 6538881 (2003-03-01), Jeakins et al.
patent: 6542360 (2003-04-01), Koizumi
patent: 6587343 (2003-07-01), Novotny et al.
patent: 6659169 (2003-12-01), Lopatinsky et al.
patent: 2002/0173267 (2002-11-01), Sharp
patent: 2002/0191430 (2002-12-01), Meir
patent: 2003/0147216 (2003-08-01), Patel et al.
patent: 2003/0209023 (2003-11-01), Spinazzola
patent: 2004/0264124 (2004-12-01), Patel et al.
patent: 0 746 192 (1996-12-01), None
patent: 2 568 172 (1986-02-01), None
“Protection for Today's Needs . . . And Tomorrow's Opportunities”, Liebert Foundation ,US.
International Searching Authority, “International Search Report from PCT/US2005/003284 (S0104/7121WO)”, Aug. 4, 2005, Patent Cooperation Treaty.
International Searching Authority, “International Search Report from PCT/US2005/002605 (S0104/7096WO)”, Aug. 1, 2005, Patent Cooperation Treaty.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and system for cooling electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for cooling electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for cooling electronic components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3839206

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.