Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-02-02
2000-06-13
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 361709, 361719, 257706, 257712, 257713, 257718, 257719, 174 152, 174 163, 174 51, 165 802, 165 803, 165 804, H05K 720
Patent
active
060757000
ABSTRACT:
A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.
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Montrose, Mark I., "Printed Circuit Board Design Techniques for EMC Compliance," IEEE Electromagnetic Compatibility Society, IEEE Press, 1996.
Brench Colin Edward
Houghton Christopher Lee
Chervinsky Boris L.
Compaq Computer Corporation
Picard Leo P.
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