Method and system for controlling plating bath parameters

Details Method and system for controlling plating bath parameters Method and system for controlling plating bath parameters

1993-02-23

1994-11-29

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Involving measuring, analyzing, or testing

205101, 204232, 204275, 427 8, 118666, 118708, 118712, C25D 2114, C25D 1700, B05C 1100

Patent

active

053687159

ABSTRACT:
The present invention is directed to an expert control system for controlling plating bath parameters. The system uses both feed-forward and feed-backward control to determine the amount and timing of replenisher additions of bath constituents to maintain optimum bath efficiency.

REFERENCES:
patent: 3649509 (1972-03-01), Morawetz et al.
patent: 4045304 (1977-08-01), Tezuka
patent: 4674440 (1987-06-01), Cardin et al.
patent: 4814197 (1989-03-01), Duffy
patent: 4886590 (1989-12-01), Tittle
patent: 5182131 (1993-01-01), Hashimoto et al.
Process Control of Electroplating Solutions by Predictive Model Control, Published Oct. 1990.
Process Control in Tin and Tin-Leading Plating of Contacts, Hurley et al., "Electronic Manufacturing", Jan. 1990.
Process Control in Automatic Tab Plating, Circuitree Magazine, Jul. 1990.
Statistical Process Control for Electronics Electroplating Applications, by John Lovie, Technical Manager and Kathleen Miscioscio, Marketing Specialist Sel-Rex, Jan. 1986.
Consistent Contact Performance Through Improved Process Control, by John Lovie, Technical Manager and Kathleen Miscioscio, Marketing Specialist, Sel-Rex. Nov. 1985.

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