Method and system for controlling chemical mechanical...

Details Method and system for controlling chemical mechanical... Method and system for controlling chemical mechanical...

2011-07-19

2011-07-19

Eley, Timothy V (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S007000, C451S008000, C451S010000, C451S041000, C451S060000, C451S446000

Reexamination Certificate

active

07980922

ABSTRACT:
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.

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Translation of Official Communication from German Patent Office for German Patent Application No. 10 2006 056 623.8-14 dated Nov. 21, 2007.

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