Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-10-10
2006-10-10
Nguyen, Vinh P. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S1540PB
Reexamination Certificate
active
07119564
ABSTRACT:
The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
REFERENCES:
patent: 3963985 (1976-06-01), Geldermans
patent: 4755747 (1988-07-01), Sato
patent: 4780836 (1988-10-01), Miyazaki et al.
patent: 5124639 (1992-06-01), Carlin et al.
patent: 5410259 (1995-04-01), Fujihara et al.
patent: 5521523 (1996-05-01), Kimura et al.
patent: 5550480 (1996-08-01), Nelson et al.
patent: 5550482 (1996-08-01), Sano
patent: 5604446 (1997-02-01), Sano
patent: 5640101 (1997-06-01), Kuji et al.
patent: 5644245 (1997-07-01), Saitoh et al.
patent: 5861759 (1999-01-01), Bialobrodski et al.
patent: 5936418 (1999-08-01), Ideta et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6043668 (2000-03-01), Carney
patent: 6064215 (2000-05-01), Kister
patent: 6137299 (2000-10-01), Cadieux et al.
patent: 6140828 (2000-10-01), Iino et al.
patent: 6441629 (2002-08-01), Khoury et al.
patent: 6674627 (2004-01-01), Kund
patent: 6710615 (2004-03-01), Miki
patent: 6927587 (2005-08-01), Yoshioka
patent: 6972578 (2005-12-01), Martens et al.
patent: 7002363 (2006-02-01), Mathieu
patent: 2003/0085721 (2003-05-01), Eldridge et al.
patent: 2003/0085724 (2003-05-01), Mathieu
patent: 2003/0087523 (2003-05-01), Martens et al.
patent: 1098200 (2001-05-01), None
patent: 61-150346 (1986-07-01), None
patent: 04-280445 (1992-06-01), None
patent: 04-273458 (1992-09-01), None
patent: 04-333250 (1992-11-01), None
patent: 04-361543 (1992-12-01), None
patent: 05-264590 (1993-10-01), None
patent: 40-5264590 (1993-10-01), None
patent: 09-005358 (1997-01-01), None
patent: 11-51972 (1999-02-01), None
patent: WO 01/69274 (2001-09-01), None
Eldridge Benjamin N.
Grube Gary W.
Larder Richard A.
Martens Rod
Mathieu Gaetan L.
Burraston N. Kenneth
FormFactor Inc.
Nguyen Vinh P.
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