Method and system for cleaning a polishing pad

Details Method and system for cleaning a polishing pad Method and system for cleaning a polishing pad

2006-03-21

2006-03-21

Wilson, Lee D. (Department: 3723)

Butchering

Slaughtering

Restraint or immobilizer

C451S041000

Reexamination Certificate

active

07014552

ABSTRACT:
A method and a system are provided for removing matter adhered to such a polishing pad. In particular, a polishing system is provided which is adapted to remove matter adhered to a polishing pad during a polishing process of a semiconductor topography. The polishing system may include a polishing pad and a spray element, which is preferably adapted to spray a pressurized fluid upon the polishing pad to remove matter adhered to the pad. In addition, a spray element is provided which may be adapted to be positioned within a polishing system. Such a spray element may be adapted to remove matter adhered to a polishing pad within the system by spraying a pressurized fluid upon the polishing pad. In addition, methods for cleaning a polishing pad during a polishing process and polishing multiple semiconductor topographies using the systems described herein are provided.

REFERENCES:
patent: 5578529 (1996-11-01), Mullins
patent: 5716264 (1998-02-01), Kimura et al.
patent: 5997392 (1999-12-01), Chamberlin et al.
patent: 6273790 (2001-08-01), Neese et al.
patent: 6283840 (2001-09-01), Huey
patent: 6284092 (2001-09-01), Manfredi
patent: 6475070 (2002-11-01), White

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