Method and system for bonding a semiconductor chip onto a...

Details Method and system for bonding a semiconductor chip onto a... Method and system for bonding a semiconductor chip onto a...

2006-06-20

2006-06-20

Vu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C438S613000

Reexamination Certificate

active

07064432

ABSTRACT:
An anisotropically conductive layer “ACL” (50) for mechanical and electrical bonding of two circuit containing structures, such as a flip chip and carrier is disclosed. The ACL is formed of a rigid insulating substrate (72) or membrane (61) with a top and bottom planar surfaces formed with a plurality of pins therein. The pins extend beyond the top and bottom surfaces so that a portion of each pin is exposed. The pins provide electrical connection between contact terminals or pads of the flip chip and carrier and additionally provide mechanical support between the flip chip and carrier so that the flip chip can under go post-bonding processing without substantial deformation or breaking. A method of electrically and mechanically bonding the flip chip and carrier and a method of making a semiconductor device using the ACL is also disclosed.

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patent: 1-128590 (1989-05-01), None
patent: 3-218030 (1991-09-01), None

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