Method and system for automatically determining electrical...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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11216505

ABSTRACT:
In a method and apparatus for determining one or more electrical properties of a semiconductor wafer or sample, the response of a semiconductor wafer or sample to an applied CV-type electrical stimulus is measured. Utilizing a recursive technique, progressively more accurate values of equivalent oxide thickness CET, maximum capacitance Cox, flatband voltage Vfb and other properties of the semiconductor wafer or sample are determined from the measured response. An equivalent oxide thickness EOT of the semiconductor wafer or sample can be determined as a function of the most accurate value of CET determined based upon convergence of at least one of (1) the last two values of Cox or (2) the last two values of Vfb within a predetermined convergence criteria. One or more of the EOT value and/or values of one or more of CET, Cox or Vfb can then be output in a human detectable form.

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patent: 6995574 (2006-02-01), Sergoyan et al.
Martin A. Green; “Intrinsic Concentration, Effective Densities Of States, And Effective Mass In Silicon”; J. Appl. Phys. 67 (6), Mar. 15, 1990; pp. 2944-2954.
Jordi Sune, Piero Olivo and Bruno Ricco; “Quantum-Mechanical Modeling Of Accumulation Layers In MOS Structure”; IEEE Transactions On Electron Devices, vol. 39, No. 7, Jul. 1992; 8 pages.
Letter, “Extension Of The McNutt-Sah Method For Measuring Thin Oxide Thickness Of MOS Devices”; Solid State Electronics, vol. 42, No. 4, pp. 671-673; (1998).
“Standard Test Method For Determining Net Carrier Density Profiles In Silicon Wafers By Capacitance-Voltage Measurements With A Mercury Probe”; ASTM Designation: F. 1392-00; pp. 390-401 (2000).

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