Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1985-12-27
1987-06-09
Ramsey, Kenneth J.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228105, 228179, 250225, B23K 3704, H01L 2160
Patent
active
046714464
ABSTRACT:
The bonding of a lead wire on a semiconductor having an ohmic contact metal electrode provided locally on a surface at a selected location is achieved through detecting the image of the metal electrode more precisely by enhancing the contrast between the metal electrode and the semiconductor surface. The enhanced contrast is accomplished by illuminating the contact-carrying surface at Brewster's angle with a beam of light rays having a wavelength in the range of the light transmission coefficient of the semiconductor material constituting the chip, and polarizing either the illuminating beam or the reflected beam or both to produce a difference in intensity of light between the contact and the light reflected from the semiconductor area. The illuminating light beam may be passed through a filter means to render a narrow frequency beam of light rays. The enhanced contrast reflecting beam is detected and converted to an electronic signal which is digitized and connected to servomechanisms that move the lead wire into bonding contact with the metal electrode.
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patent: 3499159 (1970-03-01), Carrier et al.
patent: 3567309 (1971-03-01), Jasgur
patent: 3699350 (1972-10-01), Holdaway
patent: 3785507 (1974-01-01), Wiesler
patent: 4203132 (1980-05-01), Schmitt
patent: 4347964 (1982-09-01), Takasugi
patent: 4469442 (1984-09-01), Reich
Ramsey Kenneth J.
Stanley Electric Company, Ltd.
Watkins Robert B.
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