Method and system for automated process correction using...

Details Method and system for automated process correction using... Method and system for automated process correction using...

2008-01-08

2008-01-08

Nguyen, Henry Hung (Department: 2851)

Photocopying

Projection printing and copying cameras

Focus or magnification control

C355S053000, C355S077000

Reexamination Certificate

active

07317509

ABSTRACT:
A method for aligning a substrate in a lithographic apparatus is presented. The substrate includes a plurality of alignment marks. The alignment marks have been defined by a second lithographic apparatus and are arranged to provide a substrate grid as a coordinate system that includes a first and a second direction, substantially perpendicular to the first direction. The method includes measuring a location and an orientation of the alignment marks to obtain alignment mark data; determining the substrate grid of the substrate from the alignment mark data by using a first substrate grid model with a first set of parameters; determining the substrate grid of the substrate from the alignment mark data by using a second substrate grid model with a second set of parameters, the second set of parameters including an ortho-scaling parameter in addition to the first set of parameters, and correcting machine-to-machine differences between the lithographic apparatus and the second lithographic apparatus with automated process control data based on the ortho-scaling parameter.

REFERENCES:
patent: 5243377 (1993-09-01), Umatate et al.
patent: 5757673 (1998-05-01), Osheiski et al.
patent: 6992767 (2006-01-01), Matsumoto et al.
patent: 7126669 (2006-10-01), Edart

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