Method and system for analyzing wafer yield against uses of...

Details Method and system for analyzing wafer yield against uses of... Method and system for analyzing wafer yield against uses of...

2005-12-06

2005-12-06

Nghiem, Michael (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Chemical analysis

Reexamination Certificate

active

06973390

ABSTRACT:
A method for analyzing wafer yield against uses of a semiconductor tool. A yield database includes at least yield data consisting of a wafer identity number, wafer yield, and a serial number of the semiconductor tool. A processing device generates a box plot chart according to the yield data. Thereafter, the processing device generates a P-value statistical chart according to the yield data. Then, the processing device generates a ratio limit chart according to the yield data. The processing device divides a high yield percentage value into a low yield percentage value to generate a deviant quotient. Thereafter, the processing device analyzes influence of the semiconductor equipment on the wafer yield according to the deviation limit and the deviant quotient. Finally, the semiconductor equipment is adjusted according to the box plot chart, the P-value statistical chart, and the ratio limit chart.

REFERENCES:
patent: 2002/0170022 (2002-11-01), Shirai et al.

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