Method and system for accurately marking the backside of the die

Details Method and system for accurately marking the backside of the die Method and system for accurately marking the backside of the die

1998-09-15

2000-12-19

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438 4, 438940, H01L 2100

Patent

active

061626511

ABSTRACT:
A system and method for deprocessing a semiconductor die is disclosed. The semiconductor dies has an active area and at least one feature in the active area. The method and system include tuning an ablation laser. The method and system further include ablating a first portion of the semiconductor die using a tuned ablation laser to mark a location of the feature. The first portion is distinct from the active area and has a center. The center of the first portion is substantially above the feature. The method and system also include deprocessing a second portion of the semiconductor die using the first portion as a guide.

REFERENCES:
patent: 5807763 (1998-09-01), Motika et al.
patent: 5821549 (1998-10-01), Talbot et al.
patent: 5834323 (1998-11-01), Ghafghaichi et al.
patent: 5904489 (1999-05-01), Khosropour et al.
patent: 5972723 (1999-10-01), Bartley et al.

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