Method and system for 3D alignment in wafer scale integration

Details Method and system for 3D alignment in wafer scale integration Method and system for 3D alignment in wafer scale integration

2004-12-27

2008-10-28

Lindsay, Jr., Walter L. (Department: 2812)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C355S055000, C355S072000

Reexamination Certificate

active

07442476

ABSTRACT:
A substrate bonding system has a first and a second substrate table for holding a first substrate and a second substrate, respectively, and a controller. The first substrate includes a first device having first contact pads and the second substrate a second device having second contact pads. The wafer bonding system is arranged to bond the first and second device in such a way that a circuit may be formed by the first and second device. The first and second substrate tables each include a position sensor arranged to measure an optical signal generated on an alignment marker of the first and second substrate, respectively. The first and second substrate tables include a first and second actuator respectively that is arranged to alter a position and orientation of the respective substrate table.

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