Method and support structure for air bridge wiring of an integra

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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Details

257280, 257522, 257276, 257379, H01L 2904, H01L 2128

Patent

active

059947772

ABSTRACT:
A process of manufacturing integrated circuits is disclosed for designing and implementing a hierarchical wiring system. The interconnection requirements are sorted and designed into a particular wiring level according to length. Support structures may be constructed to allow more flexibility in designing air bridge dimensions. The support structures may take the form of lateral ribs or intermediate posts, and may be fabricated of either insulating or conductive material. One integrated circuit described is a memory device, such as a dynamic random access memory.

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