Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-05-22
2007-05-22
Nguyen, Ha Tran (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
10953291
ABSTRACT:
An interface assembly (20) and method for testing a semiconductor wafer prior to performing a flip chip bumping process are provided. The interface assembly includes a flip chip bonding pad (24) having a region (28) for performing the bumping process. A test pad (22) is integrally constructed with the bonding pad and includes a probe region (26) for performing wafer-level testing prior to performing the bumping process. The integral construction of the bonding and testing pads avoids, for example, an introduction of propagation delays to test signals passing therethrough, thereby improving the accuracy and reliability of wafer test results.
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Lois Yong, Tu Anh Tran, Stephen Lee, Bill Williams and Jody Ross, “Novel Method of Separating Probe and Wire Bond Regions Without Increasing Die Size,” 2003 Electronic Components and Technology Conference, pp. 1323-1329.
Bachman Mark Adam
Chesire Daniel Patrick
Kook Taeho
Merchant Sailesh M.
Agere Systems Inc.
Nguyen Ha Tran
Nguyen Tung X.
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