Method and structures for indexing dice

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Reexamination Certificate

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C257S758000

Reexamination Certificate

active

07348682

ABSTRACT:
A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.

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patent: 5760421 (1998-06-01), Takahashi et al.
patent: 6638831 (2003-10-01), Roberts et al.
patent: 6888260 (2005-05-01), Carpi et al.
patent: 2 320 612 (2002-03-01), None
patent: 0 434 141 (1991-06-01), None
patent: WO 01/39269 (2001-05-01), None
European Search Report for EP 04 10 1599 dated Sep. 7, 2004.

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