Method and structure to support heat sink arrangement on...

Details Method and structure to support heat sink arrangement on... Method and structure to support heat sink arrangement on...

2005-02-01

2005-02-01

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C257S706000, C257S712000

Reexamination Certificate

active

06850411

ABSTRACT:
A method and an arrangement for the supporting of the weight of a heat sink or heat-dissipating thermal structure, which is arranged on the surface of a chip carrier packages. More specifically, the arrangement and method are directed to relieving stresses generated by the weight of the heat sink in the solder balls between the chip carrier package and a printed circuit board (PCB) through a unique locking connection between the chip carrier package and the printed circuit board.

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IBM Technical Disclosure Bulletin “Air-Cooled Module Heat Dissipation”, G. Dumaine, et al.; vol. 20, No. 4, Sep. 1977.

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