Method and structure to improve thermal dissipation from...

Details Method and structure to improve thermal dissipation from... Method and structure to improve thermal dissipation from...

2007-03-05

2008-12-23

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S710000, C361S718000, C361S719000, C438S222000, C257S713000, C257S721000

Reexamination Certificate

active

07468886

ABSTRACT:
A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

REFERENCES:
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5604978 (1997-02-01), Sherif et al.
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5706171 (1998-01-01), Edwards et al.
patent: 5724729 (1998-03-01), Sherif et al.
patent: 5757620 (1998-05-01), Edwards et al.
patent: 5770478 (1998-06-01), Iruvanti et al.
patent: 5819402 (1998-10-01), Edwards et al.
patent: 5881944 (1999-03-01), Edwards et al.
patent: 5956576 (1999-09-01), Toy et al.
patent: 5981310 (1999-11-01), DiGiacomo et al.
patent: 5990418 (1999-11-01), Bivona et al.
patent: 6025638 (2000-02-01), Pogge et al.
patent: 6091603 (2000-07-01), Daves et al.
patent: 6110806 (2000-08-01), Pogge
patent: 6137682 (2000-10-01), Ishimine et al.
patent: 6255139 (2001-07-01), Edwards et al.
patent: 6275381 (2001-08-01), Edwards et al.
patent: 6294408 (2001-09-01), Edwards et al.
patent: 6368881 (2002-04-01), Brouillette et al.
patent: 6451155 (2002-09-01), Toy et al.
patent: 6472762 (2002-10-01), Kutlu
patent: 6887126 (2005-05-01), Brouillette et al.
patent: 2002/0137369 (2002-09-01), Edwards et al.
patent: 2002/0158330 (2002-10-01), Moon et al.
patent: 2003/0067746 (2003-04-01), Ishimine
patent: 2003/0082847 (2003-05-01), Turner et al.
patent: 2004/0014401 (2004-01-01), Tsao et al.
patent: 2005/0127500 (2005-06-01), Colgan et al.
patent: 2005/0139992 (2005-06-01), Holalkere et al.
patent: 2006/0038281 (2006-02-01), Colgan et al.
patent: 2006/0056156 (2006-03-01), Long et al.
patent: 2006/0060952 (2006-03-01), Yuan et al.
patent: 2006/0103011 (2006-05-01), Andry et al.
patent: 2006/0180924 (2006-08-01), Andry et al.
patent: 2006/0202325 (2006-09-01), Coico et al.
patent: 2006/0261467 (2006-11-01), Colgan et al.
patent: 10070141 (1998-03-01), None
patent: 2005325348 (2005-11-01), None

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