Method and structure of integrated rhodium contacts with...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S414000, C438S630000

Reexamination Certificate

active

07843067

ABSTRACT:
The present disclosure relates to a microelectronic structure and the manufacture of the microelectronic structure. Specifically, the disclosure relates to an interconnect barrier layer between a rhodium contact structure and a copper interconnect structure in a microelectronic structure. The microelectronic structure provides for low resistance in microelectronic devices.

REFERENCES:
patent: 6787912 (2004-09-01), Lane et al.
patent: 7405154 (2008-07-01), Cabral et al.

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