Method and structure of diode

Active solid-state devices (e.g. – transistors – solid-state diode – With specified impurity concentration gradient – With high resistivity

Reexamination Certificate

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C257S355000, C438S081000

Reexamination Certificate

active

07064418

ABSTRACT:
A method and a structure of a diode are provided. The diode is used in an electrostatic discharge protection circuit using TFT (Thin Film Transistor) fabrication technology. A semiconductor layer is formed on a substrate. A first region of a first carrier concentration is formed in the semiconductor layer. A second region of a second carrier concentration is formed in the semiconductor layer. An insulator is formed on the semiconductor layer. The insulator layer is etched to form at least a contact window. The contact window exposes a portion of an upper surface of the semiconductor layer. A metal layer is formed on the insulator layer. The metal layer fills up the contact window to contact the semiconductor layer.

REFERENCES:
patent: 5610790 (1997-03-01), Staab et al.
patent: 6118154 (2000-09-01), Yamaguchi et al.
patent: 6329691 (2001-12-01), Finzi
patent: 2001/0015445 (2001-08-01), Nemoto
patent: 2004/0105203 (2004-06-01), Ker et al.

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