Method and structure for small pitch z-axis electrical...

Details Method and structure for small pitch z-axis electrical... Method and structure for small pitch z-axis electrical...

2005-10-18

2005-10-18

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S343000, C428S344000, C428S352000, C428S354000

Reexamination Certificate

active

06955849

ABSTRACT:
A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

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patent: 2002/0023777 (2002-02-01), Ochi et al.

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