Method and structure for separably and adhesively bonding two pa

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 98, 156247, 156344, B32B 706

Patent

active

054587204

ABSTRACT:
Two parts are adhesively bonded together in such a manner that after the parts have been separated, any remaining adhesive can be easily removed. This is done by placing a flexible cable-containing layer of adhesive between the two parts. The cable is arranged in a serpentine pattern and has a free end which is outside the layer.

REFERENCES:
patent: 2636835 (1953-04-01), Boulware et al.
patent: 3501797 (1970-03-01), Nappi
patent: 3888711 (1975-06-01), Breitner
patent: 4287012 (1981-09-01), Midgley et al.
patent: 4338970 (1982-07-01), Krackeler et al.
patent: 4549063 (1985-10-01), Ang et al.
patent: 4572755 (1986-02-01), hs
patent: 4824498 (1989-04-01), Goodwin et al.
patent: 4867820 (1989-09-01), Jacobson et al.
patent: 5221390 (1993-06-01), Persson et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and structure for separably and adhesively bonding two pa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and structure for separably and adhesively bonding two pa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and structure for separably and adhesively bonding two pa will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-593910

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.